Application:
Product Features:
By controlling silicon content and microstructure, a balanced combination of thermal conductivity and thermal expansion performance is achieved. The material exhibits a thermal conductivity of approximately 118–178 W/(m·K) and a linear expansion coefficient of 8–16 ppm/K, offering excellent castability, dimensional stability, and integrated structural heat dissipation capability.
Product Applications::
Primarily used for integrated heat dissipation components in communication base stations, LED lighting equipment, power electronics enclosures, and other applications requiring high structural load-bearing capacity and thermal performance.
