Application:
Product Features:
Using high thermal conductivity diamond as the reinforcement phase and copper alloy as the matrix, synergistic optimization of ultra-high thermal conductivity and controllable thermal expansion is achieved through interface engineering. The material exhibits a thermal conductivity of approximately 550–800 W/(m·K) and a linear thermal expansion coefficient of 5–8 ppm/K, making it suitable for heat dissipation applications with extremely high heat flux density.
Product Applications:
It is mainly used for the core thermal management components of high-power RF devices, microwave/laser equipment, mobile communication devices, electronic instruments and meters, as well as high-performance computing terminals and other high-end equipment.
