Application:
Product Features:
Using aluminum alloy as the matrix and introducing a high volume fraction of silicon carbide reinforcement, the thermal conductivity is significantly enhanced and the coefficient of thermal expansion is effectively reduced through composite design. Material
The thermal conductivity is approximately 180–220 W/(m·K), and the linear expansion coefficient is 7–9 ppm/K, offering excellent thermodynamic compatibility.
Product Applications::
Mainly used for heat dissipation substrates and structural components of high-power devices such as IGBT modules, power systems for new energy vehicles, and consumer electronics.
